Solder Pastes

A solder paste consists of small solder particles (lead, silver, tin) dispersed in a polymer binder. The solder paste is laid down onto a printed circuit board in the proper amount and in the proper locations. An electronic device (IC, chip resistor, etc.) is then put into place in contact with the solder paste. The printed circuit board is then heated to melt the solder paste, attaching the leads of the electronic device to the traces on the printed circuit board.